Integration circuits
“SYSTEMS ON CHIPS” DESIGN TECHNOLOGY
Super large scale integration circuit (VLSI circuit) is an electronic circuit of arbitrary complexity with the integration level more than 10 000 elements, printed on the semiconductor chip or film.
“System on the chip” (SoC) is an electronic circuit functioning as a whole device and is printed on a single integral circuit, manufactured using the submicron technology with design rules less than 0.25 µm with a maximal usage of the finished complex-functional blocks (MF-blocks, IP-blocks, IP-cores are functionally finished universal and specialized VLSI circuits components intended for reusing and being the objects of intellectual property and the offering).
“System in the package” (SiP) is the integration of several different-purpose and different-technology VLSI circuit chips in a single hybrid package.
Commercial offer
Design-center of JSC “ONIIP” invites to collaborate
Design-center of JSC “ONIIP” invites to collaborate within the framework of development of the joint projects based on the technology of creating leading solutions in the field of designing circuitry, devices, hardware and complexes.
The center was created within the scope of the federal target program “Developing electronic circuitry and radio electronics” acting up to 2015 and it is one of the first in Russia and only one over Ural.
The center has a powerful potential, from the high-performance licensed software pack and the leading edge technologies of managing and controlling projects, scientific-technological basis and to the group of the professional specialists-developers. The scientific-technical basis of the Center is formed in terms of the half-century experience of the school of thought of the Omsk scientific-research institute of the instrument engineering and close relations in terms of collaboration of the best Omsk region universities.
The main products of the Center are the essentially new developments, such as multi-functional blocks (MF-blocks) and integral circuits on their basis – Systems on chips (SoC). MF-block (or Intellectual Property (IP) in the notation of our foreign partners), allowing realizing the functionality of the unique solution, is performed according to 3 stages:
· soft – functionally-finished analog, digital or hybrid component, implemented on the basis of the programming language of high level and tested of functional fitness for use;
· firm – realization of the component accounting the topological (job) rates (from 350 to 45 nm) and technological features of the functional block realization;
· hard – MF-block, suitable for manufacturing at the specific VLSI circuits producing factory. MF-block is a finished topological construction and is a product (at every stage of realization) under patent protection ready for selling to the companies interested in using the intellectual property (design centers, VLSI circuits producing factories, system integrators).
Microsystems with topological rate less than 45 nm are manufactured by us at the factories of Russia, European countries and South-East Asia. Only having the licensed software pack allows free contacting with foreign factories, which is not available for the competitors, using mostly pirated versions of CAD without the support of the producer. It relates to the acting official global ban for factories on receiving for production VLSI-circuit SoC, developed on the basis of the unlicensed software complexes in order to prevent the counterfeit cloning and war on international terrorism.
The Center also manufactures the integral circuits of the class “system in the package” on the basis of the LTCC-technology, integration of the chips on the metal-ceramic substrate.
In comparison with the traditional technology “systems on chips” allow a considerable decrease of materials consumption and work content costs of the production, power consumption, have good technical characteristics, low cost and small mass-geometry characteristics. Microcircuits of the class “system in the package”, manufactured using the LTCC-technologies can include up to 40 layers, and are noted for compactness, strength, reliability, low losses and considerably lower cost.
Our technologies provide several-times reduction of the time spent since appearing an idea until the market entering of the finished products. Passing the certification of the standard ISO 9001 by the Design Center is the product warranty.
Developments and technologies of the Center of projection can be used in producing of the consumer goods and specialized products.
Various forms of cooperation such as creating joint companies/projects, holding joint marketing shares and events are welcome.
Contacts: 644009 Omsk, Russia, Maslennikova, 231
Tel.: (3812) 51-4957
Fax: (3812) 51-49-87
E-mail: info@oniip.ru